Tensorial Analysis of Networks (TAN) Modelling for PCB Signal Integrity and EMC Analysis

Signal integrity and electromagnetic compatibility are two of the most demanding constraints in modern printed circuit board design. This volume offers a rigorous yet practically focused exploration of Tensorial Analysis of Networks (TAN) as a systematic approach to modelling PCB interconnections, power distribution, and EMC behaviour.

What You’ll Find Inside

The editors, Blaise Ravelo and Zhifei Xu, have assembled contributions that move from foundational TAN principles through analytical calculation of PCB trace Z/Y/T/S matrices, Kron–Branin modelling, and time-domain analysis. The material is structured to help readers connect mathematical formulation with engineering application.

• TAN modelling methodology for PCB primitive components, including interconnects, vias, and power-ground planes.
• Analytical calculation of Z/Y/T/S matrices for complex trace topologies, with SPICE-based validation.
• Kron–Branin modelling for rectangular waveguide structures and mesh impedance reduction.
• Time-domain TAN approaches for lumped and distributed PCB systems.
• EMC-focused chapters covering conducted emissions, conducted susceptibility, radiated susceptibility, nonlinear behaviour, and far-field prediction.

Why TAN Matters for PCB Design

Traditional simulation methods can become computationally intensive when analysing coupled electromagnetic and circuit-level effects. The TAN framework provides an alternative pathway by organising electrical variables as tensorial quantities and applying systematic reductions. This allows engineers to gain insight into signal degradation, coupling, and radiation issues earlier in the design process.

Practical Validation and Case Studies

Throughout the book, theoretical developments are accompanied by validation results and case studies. The chapters include comparisons with SPICE simulations and demonstrate how the methods can be applied to realistic PCB structures. This makes the material valuable not only for researchers but also for design and EMC engineers looking for robust modelling techniques.

Who Will Get the Most from This Book

Engineers, researchers, and postgraduate students working in signal integrity, power integrity, and electromagnetic compatibility will find a detailed and coherent treatment of TAN methods. Readers with a background in circuit theory, electromagnetics, and PCB fundamentals will be best placed to apply the techniques discussed.

High-speed digital designers, EMC specialists, and researchers will appreciate the balance between theory and application, while the detailed case studies offer concrete starting points for adapting TAN methods to specific PCB challenges.